JPS6178123A - 基板の表面処理装置 - Google Patents

基板の表面処理装置

Info

Publication number
JPS6178123A
JPS6178123A JP19946084A JP19946084A JPS6178123A JP S6178123 A JPS6178123 A JP S6178123A JP 19946084 A JP19946084 A JP 19946084A JP 19946084 A JP19946084 A JP 19946084A JP S6178123 A JPS6178123 A JP S6178123A
Authority
JP
Japan
Prior art keywords
substrate
surface treatment
constant temperature
pure water
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19946084A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0144012B2 (en]
Inventor
Kazuo Nishii
西井　一雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP19946084A priority Critical patent/JPS6178123A/ja
Publication of JPS6178123A publication Critical patent/JPS6178123A/ja
Publication of JPH0144012B2 publication Critical patent/JPH0144012B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP19946084A 1984-09-26 1984-09-26 基板の表面処理装置 Granted JPS6178123A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19946084A JPS6178123A (ja) 1984-09-26 1984-09-26 基板の表面処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19946084A JPS6178123A (ja) 1984-09-26 1984-09-26 基板の表面処理装置

Publications (2)

Publication Number Publication Date
JPS6178123A true JPS6178123A (ja) 1986-04-21
JPH0144012B2 JPH0144012B2 (en]) 1989-09-25

Family

ID=16408168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19946084A Granted JPS6178123A (ja) 1984-09-26 1984-09-26 基板の表面処理装置

Country Status (1)

Country Link
JP (1) JPS6178123A (en])

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003086486A (ja) * 2001-09-11 2003-03-20 Canon Inc 露光装置
JP2012524408A (ja) * 2009-04-14 2012-10-11 ラム リサーチ コーポレーション 粘弾性洗浄材料を使用して基板上の粒子を除去するための装置および方法
CN102896104A (zh) * 2012-10-15 2013-01-30 京东方科技集团股份有限公司 一种基板清洗设备及基板清洗系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5511311A (en) * 1978-07-10 1980-01-26 Hitachi Ltd Method of photoresist developing
JPS57166032A (en) * 1981-04-03 1982-10-13 Toshiba Corp Spray type developing device for positive resist
JPS5868749A (ja) * 1981-10-21 1983-04-23 Toshiba Corp レジスト現像装置
JPS58128441U (ja) * 1982-02-24 1983-08-31 富士通株式会社 現像装置
JPS6083240U (ja) * 1983-11-15 1985-06-08 富士通株式会社 スピン現像機

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5511311A (en) * 1978-07-10 1980-01-26 Hitachi Ltd Method of photoresist developing
JPS57166032A (en) * 1981-04-03 1982-10-13 Toshiba Corp Spray type developing device for positive resist
JPS5868749A (ja) * 1981-10-21 1983-04-23 Toshiba Corp レジスト現像装置
JPS58128441U (ja) * 1982-02-24 1983-08-31 富士通株式会社 現像装置
JPS6083240U (ja) * 1983-11-15 1985-06-08 富士通株式会社 スピン現像機

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003086486A (ja) * 2001-09-11 2003-03-20 Canon Inc 露光装置
JP2012524408A (ja) * 2009-04-14 2012-10-11 ラム リサーチ コーポレーション 粘弾性洗浄材料を使用して基板上の粒子を除去するための装置および方法
CN102896104A (zh) * 2012-10-15 2013-01-30 京东方科技集团股份有限公司 一种基板清洗设备及基板清洗系统
CN102896104B (zh) * 2012-10-15 2014-12-10 京东方科技集团股份有限公司 一种基板清洗设备及基板清洗系统

Also Published As

Publication number Publication date
JPH0144012B2 (en]) 1989-09-25

Similar Documents

Publication Publication Date Title
US6713122B1 (en) Methods and apparatus for airflow and heat management in electroless plating
US7581335B2 (en) Substrate drying processing apparatus, method, and program recording medium
US6565928B2 (en) Film forming method and film forming apparatus
US11684955B2 (en) Chemical supply unit, substrate processing apparatus, and substrate processing method
US8286580B2 (en) Apparatus and method for treating substrate
US5376176A (en) Silicon oxide film growing apparatus
KR19990013572A (ko) 처리액공급장치
US20100233638A1 (en) Substrate treatment apparatus, substrate treatment method, coating and developing apparatus, coating and developing method, and storage medium
TWI722378B (zh) 基板處理裝置、處理液排出方法、處理液交換方法、及基板處理方法
CN1981070A (zh) 用于在半导体衬底上无电镀沉积金属的装置
JPS6178123A (ja) 基板の表面処理装置
KR100611060B1 (ko) 기판 상으로 용액을 공급하기 위한 장치
US20180158701A1 (en) Substrate liquid processing apparatus and substrate liquid processing method
JP6929729B2 (ja) 基板液処理方法、基板液処理装置及び記憶媒体
JP6632684B2 (ja) 基板液処理装置及び基板液処理方法並びに基板液処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
US10998198B2 (en) Substrate processing method and substrate processing apparatus
TWI766921B (zh) 液體處理裝置及液體處理方法
US20230187232A1 (en) Apparatus and method of treating substrate
JPS6253591B2 (en])
JP2003077878A (ja) 液処理方法及び液処理装置
TW202141614A (zh) 處理液溫度調整方法、基板處理方法、處理液溫度調整裝置、及基板處理系統
JP4034285B2 (ja) 温度調節システム及び温度調節方法
JP3629232B2 (ja) 回転式薄膜形成装置及び薄膜形成方法
JP2020077675A (ja) 基板処理方法及び基板処理装置
CN117912991B (zh) 一种单片晶圆清洗装置温度控制方法和系统